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PassionIT framework Flex Logix Pairs its InferX X1 AI Inference Accelerator with the High-Bandwidth Winbond 4Gb LPDDR4X Chip to Set a New Benchmark in Edge AI Performance
Wednesday, 27 Jan 2021 08:43 am
PassionIT News

PassionIT News

TAICHUNG, Taiwan and MOUNTAIN VIEW, Calif., Jan. 26, 2021 /PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today revealed that its low-power, high-performance LPDDR4X DRAM technology is supporting the latest breakthrough in edge computing from Flex Logix® for demanding Artificial Intelligence (AI) applications such as object recognition.

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https://www.prnewswire.com/news-releases/flex-logix-pairs-its-inferx-x1-ai-inference-accelerator-with-the-high-bandwidth-winbond-4gb-lpddr4x-chip-to-set-a-new-benchmark-in-edge-ai-performance-301215697.html